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Study on ultrasonic fusion bonding for polymer microfluidic chips

机译:聚合物微流体芯片超声融合键合研究

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Ultrasonic fusion bonding is a potential method for mass-production of polymer microfluidic chips. However, the micro structures in the chips are easily damaged or even destroyed due to poor controllability and uniformity of the melted energy directors in ultrasonic bonding process. In this paper, a novel micro joint including energy directors and flow blocks is presented. The flow profile of the melted energy directors is controlled by the dimensions of the flow blocks, auxiliary energy-equilibrating structures are also designed to prevent the uneven melt of energy directors. Polymethyl methacrylate (PMMA) microfluidic chips with the new joints were fabricated and ultrasonic bonding experiments were conducted. Micro channels with characteristic dimension of tens of microns were successfully sealed in 0.3 s and free of deformation.
机译:超声波熔合是聚合物微流体芯片的大规模生产的潜在方法。然而,由于超声波键合过程中熔化能量导向器的可控性和均匀性,芯片中的微结构易于损坏甚至破坏。本文提出了一种包括能量导演和流量块的新型微关节。熔化能量导向器的流动轮廓由流动块的尺寸控制,辅助能量平衡结构也被设计成防止能量导向器的不均匀熔体。制造具有新关节的聚甲基丙烯酸甲酯(PMMA)微流体芯片,并进行超声波键合实验。具有数十微米特性尺寸的微通道成功密封在0.3秒并没有变形。

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