Semiconductor Bonding Equipment Grouping Model Based on Processing Task Matching

摘要

For the problem that the fixed equipment grouping on the semiconductor packaging line cannot achieve the dynamic matching with the processing capacity of the processing task, this paper applies the graph theory method to the equipment grouping, and uses the topological structure of the graph theory to establish the equipment matrix. Also it uses the adjacency matrix to generate the relationship matrix between devices. And the device is grouped with closed position constraints and matching constraints between device types and processing types. A semiconductor bonding device grouping model based on processing task matching is established. The grouping model is simulated under different processing tasks, and it is verified that the equipment grouping model can realize dynamic grouping.