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Vertical Ga2O3 Schottky Barrier Diodes with Guard Ring Formed by Nitrogen-Ion Implantation

机译:垂直GA 2 O 3 带有氮离子植入的防护环肖特基屏障二极管

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A guard ring (GR) formed by nitrogen-ion implantation doping was employed to improve the breakdown voltage (Vbr) of vertical Ga2O3 Schottky barrier diodes (SBDs) by eliminating electric field concentration at the edges of anode and field-plate (FP) electrodes. Four types of vertical SBD structures with (a) neither a GR nor a FP, (b) a GR, (c) a FP, and (d) both a GR and a FP were fabricated on the same substrate. The SBDs with a GR [structures (b) and (d)] showed larger Vbr values than their GR-free counterparts [structures (a) and (c)], implying that the GR successfully redistributed the peak electric field at the anode and/or FP edges. Considering the trade-off relationship between Vbr and specific on-resistance (Ron), a Vbr/Ron combination of 1.43 kV/4.7 mΩcm2 for the GR/FP-SBD corresponds to one of the best balanced data for Ga2O3 SBDs.
机译:采用氮离子注入掺杂形成的保护环(GR)来改善垂直GA的击穿电压(VBR) 2 O. 3 通过消除阳极和现场板(FP)电极边缘处的电场浓度来通过消除肖特基势垒二极管(SBD)。用(a)的四种类型的垂直SBD结构既不是GR也不是FP,(B)GR,(C)A FP和(D)在同一基板上制造GR和FP。具有GR [结构(B)和(D)]的SBD显示比其GR的GR值更大的VBR值[结构(A)和(C)],这意味着GR成功地重新分配了阳极处的峰电电场和/或FP边缘。考虑到VBR和特定导通电阻(RON)之间的权衡关系,VBR / RON组合为1.43 kV /4.7mΩcm 2 对于GR / FP-SBD对应于GA的最佳平衡数据之一 2 O. 3 SBD。

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