Power module in package with stack configuration of the EZ-pair MOSFETs and its dual gate driver

摘要

This paper presents an innovative surface mount bottom power ground device consisting of a dual gate driver and two optimized MOSFETs in a single package to produce a high efficiency DC-DC synchronous buck power stage. The paper illustrates the structure of the new technology, novel assembly method, characterization of device, and explains the benefits of packaging technology in a DC-DC converter application. This device enables high power density voltage regulator solutions ideal for notebook PCs, servers, and graphic cards applications.