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Experimental Investigation of the Single Pulse Surge Current Ruggedness of the Body Diode of SiC Power MOSFETs

机译:SiC电源MOSFET体二极管单脉冲电流坚固性的实验研究

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The single pulse surge current ruggedness of the body diode of commercially available SiC power planar and trench MOSFETs is analyzed. The surge current tests are conducted at different gate-source voltage (Vgs=0V/-5V) under different cooling environments (with or without the heat sink). Although the recommended turn-off voltage is usually -5V given in the datasheet, it does not help improve surge ruggedness enough. The experimental results show that the better cooling environment contributes little to the surge current capability of the body diode. In all devices under test (DUTs), the gate breakdown occurs first before the short circuit between the drain and source terminals. The surge I-V trajectory is plotted and analyzed based on resistances between the source and drain terminals. The I-V characteristic curve of the body diode is monitored and the shift caused by damage on p-n junction is observed.
机译:分析了市售SiC电源平面和沟槽MOSFET的体二极管的单脉冲浪涌电流坚固性。浪涌电流测试在不同的栅极源电压下进行(V. gs = 0V / -5V)在不同的冷却环境下(有或没有散热器)。虽然建议的关断电压通常在数据表中给出 - 5V,但它没有有助于提高浪涌坚固性。实验结果表明,更好的冷却环境对体二极管的浪涌电流能力略微有影响。在所测试的所有设备(DUT)中,首先发生栅极击穿在漏极和源极端子之间的短路之前。基于源极和漏极端子之间的电阻绘制和分析浪涌I-V轨迹。监测体二极管的I-V特征曲线,观察到由P-N结造成的损伤引起的偏移。

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