Comparative study between wet and dry etching of silicon for microchannels fabrication

摘要

In this work we present a comparative study of two processes for the fabrication of an array of microchannelsfor microfluidics applications, based on integrated-circuit technology process steps, such as lithography and dryetching. Two different methods were investigated in order to study the resulting microstructures: wet and drydeep etching of silicon substrate. The typical etching depth necessary to the target application is 50 μm.