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Integrated photodiode characterization in a SiGe BiCMOS process

机译:SiGe BICMOS过程中的集成光电二极管表征

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In this paper three photodetector structures were simulated, fabricated and characterized at 850nm in a SiGe BiCMOS process. The measurement and simulation results suggest that the additional vertical layers offered by SiGe process compared to CMOS can facilitate higher detector bandwidth at the expense of reduced low frequency responsivity.
机译:在本文中,在SiGe Bicmos工艺中模拟,制造,制造和以850nm制成,制造和表征。 测量和仿真结果表明,与CMOS相比,SiGe过程提供的附加垂直层可以促进较高的检测器带宽,以牺牲低频响应率降低。

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