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New packaging materials Direct chip interconnection: Ss the printed circuit board coming to the end of its useful life?

机译:新包装材料直接芯片互连:SS印刷电路板可实现其使用寿命的结尾?

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This paper is divided into three main sections. The first part introduces a number of key concepts that underpin the authors' view of direct chip interconnection as a natural stage in the evolution of electronic systems architecture. The second section briefly examines a number of approaches which have given considerable impetus to the move towards direct chip interconnection. In particular, the role of programmable logic and the emergence of three dimensional structures will be examined as enabling techniques. Finally, the authors' own project is detailed and some general conclusions are drawn in an attempt to answer the question 'Is the printed circuit board coming to the end of its useful life?'. Examples relating to computer systems and subsystems and the construction of a solid state PC for embedded applications will be used to illustrate the paper.
机译:本文分为三个主要部分。 第一部分介绍了许多关键概念,该概念基于电子系统架构演变中的直接芯片互连视为直接芯片互连。 第二部分简要介绍了许多方法,该方法对直接芯片互连的移动提供了相当大的推动力。 特别是,将检查可编程逻辑的作用和三维结构的出现将被检查为实现技术。 最后,提交人自己的项目详细说明,一些一般的结论是为了回答问题的尝试,是印刷电路板来到其使用寿命的结尾?'。 与计算机系统和子系统有关的示例以及用于嵌入式应用的固态PC的构造将用于说明纸张。

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