首页> 外文会议>International symposium on trends and new applications of thin films;TATF '98 >Gradient Interface Layers to Improve c-BN Thin Film Adhesion
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Gradient Interface Layers to Improve c-BN Thin Film Adhesion

机译:梯度接口层改善C-BN薄膜粘附

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The poor adhesion commonly observed for c-BN thin films is caused by the high compressive stress of the films, and the low adhesion strength at the interface. A close examination of the special nature of the c-BN/substrate interface shows that the textured h-BN nucleation layer is mechanically the weakest link of the system and should thus be avoided. Further measures to increase the adhesion strength are a rough interface, and interfacial adhesion layers. First experiments to deposit a graded interface layer (B → BN) result in extremly rough interfaces, a reduced nucleation layer thickness, and a drastically improved adhesion.
机译:对于C-BN薄膜通常观察到的差的粘附性是由膜的高压缩应力引起的,并且界面处的低粘合强度引起。 密切检查C-BN /衬底界面的特殊性表明,纹理的H-BN成核层是机械的最薄弱的链路,因此应该避免。 增加粘合强度的进一步措施是粗糙的界面和界面粘附层。 第一实验沉积渐变界面层(B→BN),导致极端粗糙的界面,降低的成核层厚度和急剧改善的粘合性。

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