RESIN FOR TEMPORARY ADHESION, RESIN LAYER FOR TEMPORARY ADHESION, HARD SUBSTRATE PROVIDED WITH RESIN LAYER FOR TEMPORARY, THIN-FILM SUBSTRATE LAYERED BODY, AND PROCESS FOR PROCESSING THIN-FILM SUBSTRATE

摘要

To provide a resin layer for temporary adhesion, whereby a thin-film substrate used in a display, a component in an electronic device, etc., can be reliably fixed/conveyed and processed without positional misalignment, a vacuum device is not affected by decomposition or contaminants such as evolved gas (outgassing), there is no infiltration of strong acids or polar solvents during patterning, and adhesion can be satisfactorily maintained in processing of the thin-film substrate, even in heat-treatment thereof. Provided are: a resin for temporary adhesion, for temporarily adhering a thin-film substrate to a hard substrate as a base during processing of the thin-film substrate, the resin for temporary adhesion characterized by including at least one type of fluororesin; and a resin layer for temporary adhesion, formed from the resin for temporary adhesion.