Application of a Chemically Adsorbed Monolayer and Polypyrrole Thin Film for Increasing the Adhesion Force Between the Resin Substrate and the Plated Copper Layer

摘要

A chemically adsorbed monolayer containing pyrrolyl group (Pyrrolyl-CAM) was prepared between a plated copper layer and a resin substrate for increasing the adhesion force without roughening a surface of the resin substrate. Although it was not enough to increase the adhesion force between the resin substrate and the copper layer by using only Pyrrolyl-CAM, the sufficient adhesion force was obtained by preparing a polypyrrole thin film between Pyrrolyl-CAM and the copper layer. Pyrrolyl-CAM and the polypyrrole thin film on the substrate were evaluated by an automatic contact angle meter and auger electron spectroscopy in order to analyze the condition of the films between the resin substrate and the copper layer. The peel strength test was carried out in order to evaluate the adhesion force. The best adhesion force was 0.98[N/mm], and the target value of 0.60[N/mm] was sufficiently achieved.