Advances in Dispensing Processes for Flip Chip Underfill

摘要

The next generations of microprocessors from most major IC manufacturers use flip chip connection techniques. There are several low cost flip chip on laminate products and flip chip on flex assembiles that are being introduced on consumer products. Motorola is in production using flip chips on laminate for various communications products. IBM, Motorola, AMD and Intel are all producing production volumes of microprocessor products with flip chips on laminate or ceramic. The inherent speed, I/O density, small size, and heat sinking capability advantages of flip chip interconnection make it the technology of choice for advanced IC packaging of high I/O devices or high performance chips.