Formation of Cu_6Sn_5/(Cu, Ni)_6Sn_5 Intermetallic Compounds between Cu_3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding

摘要

This paper presents the use of the transient liquid phase concept to grow the high temperature Cu_6Sn_5 intermetallic compound between Cu_3Sn-rich powdered alloys and molten Sn. In this study, high temperature powdered alloys containing high fractions of Cu_3Sn were fabricated from a chill-cast Sn-60 wt.%Cu alloy. A ternary alloy with composition of Sn-59 wt.%Cu-1 wt.%Ni was also prepared to investigate the effect of Ni. The reaction products were obtained at 250°C over a period of 30 minutes. The results provide new insight into the mechanism of the interfacial reaction between liquid Sn and solid Cu_3Sn-rich alloy with and without Ni additions.