首页> 外文会议>応用物ç†å­¦ä¼šå­¦è¡“講演会;応用物ç†å­¦ä¼š >Observation of Reverse Leakage Currentin(001)β-Gallium Oxide Schottky Barrier Diodesby High Sensitive Emission Microscope
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Observation of Reverse Leakage Currentin(001)β-Gallium Oxide Schottky Barrier Diodesby High Sensitive Emission Microscope

机译:(001)β-镓氧化镓肖特基二极管高敏感发射显微镜的反向漏电流观察

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β-Gallium oxide (β-Ga_2O_3) possesses a wide bandgap of 4.8 eV which makes this material more preferable for high-power electronic devices. Besides, large size single crystal of β-Ga_2O_3 can be achieved from melt growth techniques that are economically beneficial for large-scale device fabrication. However, crystal defects in this material are the main obstacle for the reliability of device operation, yet their impact on device characteristic is not clearly known. Therefore, in this study, by utilizing a high sensitive emission microscope, we investigate and identify the origin of reverse leakage current in β-Ga_2O_3 Schottky barrier diodes (SBDs).Vertical-type EFG-grown (001) β-Ga_2O_3 SBDswere fabricated and investigated. Ni/Au was evaporated on the surface to form Schottky barrier contacts, and Ti/Au was evaporated on the back face to form ohmic contact. SBDs were observed from the back face by the emission microscope with a high sensitive CCD camera during reverse bias operation. After the emission microscope observation, the Schottky contacts and the surface were etched to form etch pits and patterns.
机译:β-氧化镓(β-GA_2O_3)具有4.8 EV的宽带隙,这使得该材料更优选高功率电子设备。此外,可以通过对大规模设备制造的经济有益的熔体生长技术来实现β-GA_2O_3的大尺寸单晶。然而,这种材料中的晶体缺陷是器件操作可靠性的主要障碍,但它们对器件特性的影响不明确。因此,在本研究中,通过利用高敏感发射显微镜,我们研究并识别β-GA_2O_3肖特基势垒二极管(SBDS)的反向漏电流的起源。似型EFG生长(001)β-GA_2O_3 SBDS制造和研究。在表面上蒸发Ni / Au以形成肖特基势垒触点,并且在背面上蒸发Ti / Au以形成欧姆接触。在反向偏置操作期间,通过发射显微镜从背面从后面观察SBDS。在发射显微镜观察之后,蚀刻肖特基触点和表面以形成蚀刻凹坑和图案。

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