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Determination of Thickness of Electrochemically Etched Si Layers Passivated by Si_3N_4 by Analysis of the Experimental Spectral Reflectance

机译:通过实验光谱反射率分析测定Si_3N_4钝化的电化学蚀刻Si层的厚度

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Porous silicon (pSi) samples for photovoltaics applications were prepared by the method of electrochemical etching in the hydrofluoric acid (HF) solution. P-type silicon wafers (boron-doped) were used as substrate. Different parameters of the electrochemical etching method (electrical potential and current, etching time) have been used in the production of pSi samples. Optical properties of pSi samples were experimentally studied by UV-VIS spectrometer. The thickness of the porous layer formed on the Si substrate surface was determined by using theoretical model of spectral reflectance. Effective medium approximation theory (Looyenga) was used in construction of this theoretical model.
机译:通过在氢氟酸(HF)溶液中的电化学蚀刻方法制备用于光伏应用的多孔硅(PSI)样品。使用p型硅晶片(硼掺杂)作为基质。在PSI样品的生产中使用了电化学蚀刻方法(电电位和电流,蚀刻时间)的不同参数。通过UV-Vis光谱仪通过实验研究PSI样品的光学性质。通过使用光谱反射率的理论模型确定形成在Si衬底表面上的多孔层的厚度。有效的中等近似理论(Loyenga)用于构建本理论模型。

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