MEASURES TO MINIMIZE CONTAMINATION DURING WAVE AND REFLOW SOLDERING

摘要

The paper describes the basic causes and remedial measures of contamination that may occur during the soldering processes of a PCB (e.g. flux residues, solder balls) and which standards and tests are applicable. In addition, the possibilities of common soldering systems are described in order to be able to process PCBs with a minimum of impurities. Two methods are presented which can significantly contribute to the cleanliness of the PCB by means of adapted processes. Applying the so-called plasma fluxing for flux application can result in reduced residues after the soldering process as no liquid is necessary for the application and pure adipic acid can be used as flux material. For the void-reduced reflow soldering, high pressure reflow soldering is described and the effects of the process on flux contamination and solder ball formation compared to vacuum soldering are shown by way of examples.