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Operating a reflow furnace to manufacture solder products for reflow soldering of electrical/electronic components onto a substrate using solder paste, comprises measuring residual oxygen content in interior of the furnace using a sensor
Operating a reflow furnace to manufacture solder products for reflow soldering of electrical/electronic components onto a substrate using solder paste, comprises measuring residual oxygen content in interior of the furnace using a sensor
The method for operating a continuous soldering furnace (2) such as a reflow furnace to manufacture solder products for reflow soldering of electrical/electronic components onto a substrate using a solder paste, comprises measuring the residual oxygen content in an interior (7) of the furnace using a sensor during the soldering process, where the sensor passes through the furnace during the measurement. The sensor is moved through the furnace instead of solder product or on/to the solder product or a product similar/corresponding to the solder product. The method for operating a continuous soldering furnace (2) such as a reflow furnace to manufacture solder products for reflow soldering of electrical/electronic components onto a substrate using a solder paste, comprises measuring the residual oxygen content in an interior (7) of the furnace using a sensor during the soldering process, where the sensor passes through the furnace during the measurement. The sensor is moved through the furnace instead of solder product or on/to the solder product or a product similar/corresponding to the solder product. A measurement data delivered from the sensor is transferred to an evaluation device present outside of the furnace using a data connection. The evaluation device receiving the measurement data delivered from the sensor is moved together with the sensor through the furnace. A data storage unit receiving the measurement data is arranged to the sensor and is moved together with the sensor through the furnace, where the sensor is a lambda probe. A further sensor is present to measure further parameter such as temperature and/or the flow conditions of the solder atmosphere. An independent claim is included for a device for measuring residual oxygen content in an interior of a continuous soldering furnace such as a reflow furnace.
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