首页> 外国专利> Operating a reflow furnace to manufacture solder products for reflow soldering of electrical/electronic components onto a substrate using solder paste, comprises measuring residual oxygen content in interior of the furnace using a sensor

Operating a reflow furnace to manufacture solder products for reflow soldering of electrical/electronic components onto a substrate using solder paste, comprises measuring residual oxygen content in interior of the furnace using a sensor

机译:操作回流炉以制造用于使用焊膏将电气/电子部件回流焊接到基板上的焊料产品,包括使用传感器测量炉内部的残余氧含量。

摘要

The method for operating a continuous soldering furnace (2) such as a reflow furnace to manufacture solder products for reflow soldering of electrical/electronic components onto a substrate using a solder paste, comprises measuring the residual oxygen content in an interior (7) of the furnace using a sensor during the soldering process, where the sensor passes through the furnace during the measurement. The sensor is moved through the furnace instead of solder product or on/to the solder product or a product similar/corresponding to the solder product. The method for operating a continuous soldering furnace (2) such as a reflow furnace to manufacture solder products for reflow soldering of electrical/electronic components onto a substrate using a solder paste, comprises measuring the residual oxygen content in an interior (7) of the furnace using a sensor during the soldering process, where the sensor passes through the furnace during the measurement. The sensor is moved through the furnace instead of solder product or on/to the solder product or a product similar/corresponding to the solder product. A measurement data delivered from the sensor is transferred to an evaluation device present outside of the furnace using a data connection. The evaluation device receiving the measurement data delivered from the sensor is moved together with the sensor through the furnace. A data storage unit receiving the measurement data is arranged to the sensor and is moved together with the sensor through the furnace, where the sensor is a lambda probe. A further sensor is present to measure further parameter such as temperature and/or the flow conditions of the solder atmosphere. An independent claim is included for a device for measuring residual oxygen content in an interior of a continuous soldering furnace such as a reflow furnace.
机译:用于操作诸如回流炉之类的连续焊接炉(2)以制造用于使用焊膏将电气/电子部件回流焊接到基板上的焊料产品的方法,该方法包括:测量在其内部(7)中的残余氧含量。在焊接过程中使用传感器的熔炉,其中传感器在测量过程中穿过熔炉。传感器移动通过熔炉而不是焊料产品,或者移至焊料产品上或焊料产品上或与焊料产品类似/对应的产品上。用于操作诸如回流炉之类的连续焊接炉(2)以制造用于使用焊膏将电气/电子部件回流焊接到基板上的焊料产品的方法,该方法包括:测量在其内部(7)中的残余氧含量。在焊接过程中使用传感器的熔炉,其中传感器在测量过程中穿过熔炉。传感器移动通过熔炉而不是焊料产品,或者移至焊料产品上或焊料产品上或与焊料产品类似/对应的产品上。从传感器传来的测量数据通过数据连接传输到位于炉外的评估装置。接收从传感器传送来的测量数据的评估设备与传感器一起通过熔炉移动。接收测量数据的数据存储单元布置在传感器上,并与传感器一起通过熔炉,其中传感器是λ探头。存在另一个传感器以测量其他参数,例如温度和/或焊料气氛的流动条件。对于用于测量诸如回流炉之类的连续焊接炉内部中的残余氧含量的装置,包括独立权利要求。

著录项

  • 公开/公告号DE102009003023A1

    专利类型

  • 公开/公告日2010-11-18

    原文格式PDF

  • 申请/专利权人 ROBERT BOSCH GMBH;

    申请/专利号DE20091003023

  • 发明设计人 KONRAD JOHANN;GHAFFARI ASHTIANI FATEMEH;

    申请日2009-05-12

  • 分类号B23K1/008;B23K1/012;B23K1/015;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:59

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