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Comparison Between Wave Soldering and Reflow Soldering

机译:波峰焊与回流焊的比较

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摘要

As contemporary electronics embrace light weight, increasing efficiency, and high speed, each link of the manufacturing process also conforms to this philosophy, including printed circuit board (PCB) assembly. Soldering has played an essential role in determining the success of electronic products, since electrical connections derive from precise soldering. Compared with hand soldering, automatic soldering has been widely selected due to its merits of high accuracy and speed, and the demands of large volume and high cost-effectiveness. As the leading soldering technologies for assembly, wave soldering and reflow soldering have been most widely applied to high-quality assembly; however, the differences between the two technologies continue to confuse many, and when each should be used is also vague.
机译:随着现代电子产品重量轻,效率提高和速度加快,制造过程的每个环节也符合这一理念,包括印刷电路板(PCB)组装。焊接在决定电子产品的成功方面起着至关重要的作用,因为电连接是通过精确焊接获得的。与手工焊接相比,自动焊接具有精度高,速度快,体积大,成本效益高等优点,因此被广泛选择。作为装配的领先焊接技术,波峰焊和回流焊已被最广泛地应用于高质量装配。但是,两种技术之间的差异继续使许多人困惑,何时使用每种技术也很模糊。

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    《NASA Tech Briefs》 |2018年第2期|12-14|共3页
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