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Adhesion Performance and Wear Resistance of Multilayered TiN Coating Deposited by Hollow Cathode Discharge Method

机译:空心阴极放电法沉积多层锡涂层的粘附性能和耐磨性

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Multilayered TiN coating was successfully prepared by hollow cathode discharge method. By introduction of the multilayered microstructure, the columnar epitaxial growth of TiN grains was obviously suppressed. The hardness, adhesion performance and wear resistance of the multilayered TiN coating were compared with those of the ordinary TiN coating. The wear resistance of the multilayered TiN coating is much better than that of the ordinary TiN coating. It is due to the multilayered microstructure of the coating that pileups the dislocations and also inhibits the bulk-flaking behavior for the multilayered TiN coating. The morphology analysis of cross section shows that the wear mechanism of the multilayered TiN coating is the micro-area detachment. Moreover, the adhesion of the TiN coating to the substrate is greatly enhanced by the microstructure optimization of the coating.
机译:通过中空的阴极放电方法成功制备多层锡涂层。通过引入多层微观结构,显然抑制了锡颗粒的柱状外延生长。将多层锡涂层的硬度,粘附性能和耐磨性与普通锡涂层的涂层进行比较。多层锡涂层的耐磨性远远优于普通锡涂层的耐磨性。它是由于涂层的多层微观结构堆积了脱位,并且还抑制了多层锡涂层的体积剥落行为。横截面的形态分析表明,多层锡涂层的磨损机理是微面积脱离。此外,通过涂层的微观结构优化,大大提高了锡涂层对基板的粘附性。

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