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Modeling for contact resistance between metallic carbon nanotubes and semiconducting substrates of field emission devices

机译:金属碳纳米管与场发射装置半导体基板之间的接触电阻建模

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摘要

A Schottky Barrier would inevitably exist in Metal-Semiconductor contact, which will cause a contact resistance that effect emission current of field emission devices. A model of contact resistance between metallic carbon nanotubes (CNT) and doped semiconducting substrates is proposed in this paper to evaluate this effect. Besides, factors that impact this contact are discussed, which could be valuable for the design of CNT field emission devices.
机译:金属半导体触点中的肖特基屏障将不可避免地存在,这将导致场发射装置的发射电流的接触电阻。本文提出了金属碳纳米管(CNT)和掺杂半导体基材之间的接触电阻模型,以评估这种效果。此外,讨论了影响这种接触的因素,这对于CNT现场发射装置的设计可能是有价值的。

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