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Modeling for contact resistance between metallic carbon nanotubes and semiconducting substrates of field emission devices

机译:场发射器件的金属碳纳米管与半导体衬底之间的接触电阻建模

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摘要

A Schottky Barrier would inevitably exist in Metal-Semiconductor contact, which will cause a contact resistance that effect emission current of field emission devices. A model of contact resistance between metallic carbon nanotubes (CNT) and doped semiconducting substrates is proposed in this paper to evaluate this effect. Besides, factors that impact this contact are discussed, which could be valuable for the design of CNT field emission devices.
机译:金属-半导体接触中不可避免地会存在肖特基势垒,这将导致接触电阻影响场发射器件的发射电流。本文提出了一种金属碳纳米管(CNT)与掺杂半导体衬底之间的接触电阻模型,以评估这种效果。此外,讨论了影响这种接触的因素,这对于CNT场发射器件的设计可能是有价值的。

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