We report the development of a metallic colloid sintering process enabling the creation of bonding layers at moderate temperatures ranging from 150°C to 300°C, and pressures lower than 5 MPa. This colloidal n-propyl acetate dispersion of Ag nanoparticles, having an average size distribution of 103 nm, was used in sintered interconnect fabrication. Open air sintering of a 10 um thick film resulted in an average resistivity of 0.20·10{sup}(-6) Ω·m - 0.30·10{sup}(-6) Ω·m. Film resistances were found to be as low as 0.18·10{sup}(-6) Ω·m. Independent tests varying either pressure or temperature were correlated to ultimate shear strength and modulus. The analysis of a 1cm{sup}2 bond area resulted in a peak shear strength of 5.83 MPa and shear modulus of 346 MPa which occurred following bonding at 300°C with a pressure of 4.219 MPa.
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