The movement in the Telcom industry towards MSAs (Multi-Source Agreements) is both a blessing and a curse to the optoelectronic packaging industry. There are different MSAs affecting the same type of product, de-facto MSAs on older devices that have wormed their way into processes, and new devices that beg for MSA activity to entrench adoption of the component into the industry. Devices affected range from commodity-type laser sources to the complicated multiple port devices such as MOEMS (MicroOptoElectroMechanical Systems). The problem is many components already have manufacturing packaging processes that are integral to the device itself. In turn, these integral processes thwart the industry's shift towards outsourced component manufacturing. MSAs currently address each type of component, but do not dictate cohesiveness across component functional lines. Consolidating packaging processes across component lines cause process changes at great expense and redesign effort. The differences in packaging methodologies must be understood, MSAs well-defined, and packaging efforts approached from the sub-component level before consolidation of multiple packaging process into one efficient process is realized. Finally, the ultimate packaging Utopia is reached if the same packaging processes can be applied to any optoelectronic or passive components.
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