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IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions

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1.PCB DESIGN OPTIMIZATION OF 0201 PACKAGES FOR ASSEMBLY PROCESSES

机译：PCB设计优化0201包装装配过程
- 作者：Mei Wang;Dongkai Shangguan;David Geiger;Fredrik Mattsson;Sammy Yi
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
2.DATA TRANSPORT OVER SONET/SDH (DOS)

机译：SONET / SDH（DOS）的数据运输
- 作者：Charlie Roach
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
3.PARTITIONING EFFICIENCY FOR MOBILE APPLIANCES

机译：移动设备的分区效率
- 作者：Charles E. Bauer;Walter Marcinkiewicz
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
4.THERMAL PERFORMANCE OF PACKAGES USED FOR A 'XAUI' HIGH SPEED INTERFACE

机译：用于“XAUI”高速接口的封装的热性能
- 作者：Keith Bailey;Roger Emigh
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
5.CFD-BASED DESIGN AND OPTIMIZATION OF A 1U MOTORIZED IMPELLER FOR TELECOM APPLICATIONS

机译：基于CFD的电信应用的基于CFD的设计与优化，用于电信应用的1U电动叶轮
- 作者：I. F. Obinelo
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
6.SYNTHESIZER-BASED HIGH FREQUENCY, LOW PHASE JITTER OSCILLATOR DESIGN

机译：基于合成器的高频，低相位抖动振荡器设计
- 作者：Thomas Knecht
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- VCXOs;
- Reference clocks;
- SONET;
7.THERMAL INTERFACE MATERIAL SOLUTIONS FOR TELECOM COMPONENTS

机译：电信组件的热界面材料解决方案
- 作者：Paul A. Berry;Jesus Marin
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Thermally conductive materials;
- Gel;
- Adhesive;
- Compound;
- Encapsulant;
8.SOLUTIONS TO MEET HAND-HELD MARKET'S REQUIREMENT FOR LOW COST ADVANCED REFLOW AND ENVIRONMENTALLY SENSITIVE PACKAGING

机译：解决方案，以满足手持市场对低成本高级回流和环保敏感包装的要求
- 作者：Fonzell Martin;Trent Thompson
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
9.EMI SHIELDING TEST METHOD FOR SMALL WIRELESS DEVICES

机译：EMI屏蔽小型无线设备的测试方法
- 作者：Robert Foster;David Rich;Doug Nobbs;Robert Stiffler;Stan Tozlowski;Dan Ventura
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- EMI shielding;
- Conductive elastomers;
- Conductive plastics;
10.A VIEW OF TOMORROW'S OPTICAL PACKAGING TECHNOLOGY

机译：明天的光学包装技术的看法
- 作者：Harry Bonham
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Optics;
- Packaging;
- Automation;
- Fibers Optics;
- Optical Assembly;
11.X-RAY INSPECTION FOR OPTOELECTRONIC COMPONENTS - THE ROLE OF ADVANCED DETECTOR TECHNOLOGY

机译：光电元件X射线检测 - 先进探测器技术的作用
- 作者：Vikram Butani
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- X-ray inspection;
- Optoelectronics;
- Digital detector;
- ADR;
12.HERMETIC VS. NON-HERMETIC OPTOELECTRONIC PACKAGING: MEETING, NOT EXCEEDING APPLICATION REQUIREMENTS

机译：密封vs.非密封光电包装：会议，不超过应用要求
- 作者：Leo M. Higgins III
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Optoelectronic Packaging;
- Hermetic;
- Non-hermetic;
13.ASSESSING THE EFFECT OF FINE PITCH BGA PACKAGES ON MOTHERBOARD DESIGN AND BOARD LEVEL RELIABILITY

机译：评估精细间距BGA封装对主板设计和板级可靠性的影响
- 作者：Michael Leoni;David Patten
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Substrate;
- Pitch;
- Reliability;
- Design;
- Solder-joint;
14.ACCELERATED LIFE TESTING, AND ITS INTERACTION WITH QUALIFICATION TESTS

机译：加速寿命测试，及其与资格测试的互动
- 作者：E. Suhir
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
15.DESIGN, MANUFACTURABILITY AND COST CONSIDERATIONS FOR BASEBAND AND MEMORY STACKED DIE SYSTEM IN PACKAGE SOLUTIONS

机译：包解决方案中基带和内存堆叠模具系统的设计，可制造性和成本考虑
- 作者：Jeannie Miller;Trent Thompson;Mark Gerber
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
16.ASSEMBLY OF TELECOM HARDWARE MODULES, BASED ON INNOVATIVE CAPILLARY CONNECTION TECHNOLOGY (C2-TECHNOLOGY)

机译：基于创新毛细管连接技术（C2-Technology）的电信硬件模块组装
- 作者：A. Taran;A. Belov;Ph. D. V. Krivoshapko
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
17.LIFE PREDICTION OF LEAD FREE SOLDER JOINTS FOR HANDHELD PRODUCTS

机译：手持产品无铅焊点的寿命预测
- 作者：Dongji Xie;Minna Arra;Hoang Phan;Dongkai Shangguan;David Geiger;Sammy Yi
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
18.PLANAR MAGNETIC DEVICES SOLUTIONS FOR TODAYS HIGH DENSITY DISTRIBUTED POWER APPLICATIONS

机译：今天的Planar磁性设备解决方案高密度分布式电源应用
- 作者：Philip A. Harding;Charles Tapscott;Romeo Visan;Gregory Corfar
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
19.SPLICING LOSS CONTROL AND ASSEMBLY YIELD MANAGEMENT

机译：拼接损失控制和装配产量管理
- 作者：Bert Zamzow;Katsuji Takasu
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Fiber;
- Splice;
- Loss;
- Loss distribution;
- Fusion;
- Electrode;
- Stabilize;
- Yield;
- Acceptance criterion;
- Rework;
20.SWITCHED BLAZED GRATING FOR OPTICAL NETWORKING

机译：用于光学网络的开关闪光光栅
- 作者：Walter M. Duncan;Terry Bartlett;Benjamin Lee;Don Powell;Paul Rancuret;Bryce Sawyers
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
21.A NOVEL APPROACH TO THERMAL MANAGEMENT AND EMI SHIELDING VIA A METALLIC CONFORMAL COATING ON A PLASTIC HOUSING

机译：通过塑料壳体金属保形涂层的热管理和EMI屏蔽的新方法
- 作者：John Hannafin
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Thermal management;
- EMI shielding;
- Conductive coating;
- Adhesion;
- Heat spreaders;
22.OPTIMIZING TEST STRATEGIES DURING PCB DESIGN FOR BOARDS WITH LIMITED ICT ACCESS

机译：有限ICT访问电路板PCB设计期间优化测试策略
- 作者：Charles Robinson;Amit Verma
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- AXI;
- AOI;
- DFT;
- DFM;
- DFx;
- Test Strategy;
- ICT;
- Limited Test Access;
23.PROGRESSION TOWARDS A FULLY INTEGRATED RF TRANSCEIVER MODULE

机译：朝向完全集成的RF收发器模块的进展
- 作者：Mark V. Christensen
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Mobile Phones;
- RF Design;
- RF Modules;
- Passives;
24.LOW COST OPTOELECTRONIC COMPONENT FABRICATION AND PACKAGING

机译：低成本光电子成分制造和包装
- 作者：Donald J. Hayes;Ting Chen;W. Royall Cox
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Micro-optics;
- Ink-jet printing;
- Solder bumping;
25.OPTOELECTRONIC FINGERPRINT SENSOR FOR MOBILE PHONES

机译：用于移动电话的光电指纹传感器
- 作者：Guy Immega;Niall Parker
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- ID;
- Identity;
- Fingerprint;
- Biometric;
- Sensor;
26.DIRECT PART MARKING IN CIRCUIT BOARD ASSEMBLY AND TEST

机译：电路板组装和测试中的直接零件标记
- 作者：David S. Thorpe
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Direct part marking;
- Data Matrix;
27.HISTORY, TRENDS AND ISSUES RELATED TO MICROPROCESSOR PACKAGES USED IN HANDHELD WIRELESS PRODUCTS

机译：与手持式无线产品中使用的微处理器包相关的历史，趋势和问题
- 作者：Tom Gregorich;Edward Reyes
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Wireless;
- Microprocessor;
- Area array;
- TQFP;
- PBGA;
- FBGA;
- CSP;
- Flip chip;
- Stacked;
- Wirebond;
- Cellular;
28.THE FOUNDATION BLOCKS FOR THE NEXT GENERATION NETWORK ELEMENTS

机译：下一代网络元素的基础块
- 作者：Charlie Roach
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
29.MSA EFFECTS ON OPTOELECTRONIC DEVICE PACKAGING

机译：MSA对光电器件包装的影响
- 作者：Amy Dugan
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
30.NOVEL PACKAGING APPROACHES FOR MINIATURE ANTENNAS

机译：微型天线的新型包装方法
- 作者：Will McKinzie;Greg Mendolia;John Dutton;Jim MacDonald;Richard Wallace
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
- Bluetooth antenna;
- DCL shorted patch antenna;
- Bluetooth MCM;
31.LOW PROFILE TRANSFORMERS USING LOW TEMPERATURE CO-FIRE MAGNETIC TAPE

机译：使用低温共用磁带的低调变压器
- 作者：John Bielawski;George Slama;A. H. Feingold;C. Y. D. Huang;M. R. Heinz;R. L. Wahlers
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
32.RF MEMS DEVICES FOR WIRELESS COMMUNICATION

机译：RF MEMS用于无线通信的设备
- 作者：Jeong-Bong Lee;Nimit Chomnawang;Sangwon Park;Kabseog Kim;W. Alan Davis
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年
33.MICRO ASSEMBLY WITH SILICON MICROFABRICATED COMPONENTS

机译：微包装用硅微制酶组分
- 作者：Matthew Ellis
- 会议名称：《IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions》 | 2002年