A VIEW OF TOMORROW'S OPTICAL PACKAGING TECHNOLOGY

摘要

The growth of optical networks and implementation of DWDM has resulted in numerous optical devices using a variety of technologies -MEM, AWG, Discrete Micro Optics, etc. While much innovation and creativity has been applied to developing reliable devices, the packaging technology used to protect optics and to interface these devices to the next assembly has not greatly changed. Currently most modules are assembled using tedious manual process requiring skilled labor. This paper will discuss packaging needs, current practices, and will share some ideas related to future practices. The intent is to present general concepts and is not to judge the relative merits of one method, technology, or supplier over another.