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Thermoelastic Damping Dependent Quality Factor Analysis of Rectangular Plates Applying Modified Coupled Stress Theory

机译:矩形耦合应力理论矩形板的热弹性阻尼依赖性质量因子分析

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Thermoelastic damping plays an essential role among the different energy dissipation mechanisms and should be minimized in MEMS/NEMS based resonators for enhancing its performance parameters. In this paper, the different performance indices analyzed are quality factor, thermoelastic frequency and figure of merit of the resonator using five different structural materials (polySi, diamond, Si, GaAs and SiC). Figure of merit is the product of quality factor and thermoelastic frequency which should be maximized in order to provide better sensitivity and noise rejection for resonators. As the size of the devices is scaled down, classical continuum theories are not able to explain the size effect related mechanical behaviour at micron or submicron levels and as a result non-classical continuum theories are employed with the inception of internal length scale parameters. Analysis of isotropic rectangular micro-plates based on Kirchhoff model applying Modified Coupled Stress Theory is used to analyze the size-dependent thermoelastic damping and its impact on quality factor and subsequently on Figure of Merit of the resonator. It is found that the Q_(TED)of the beams predicted by the non-classical MCST based model are larger than that predicted by the classical beam model. The descending material order in which Q_(TED)varies is polySi>Si>diamond>GaAs>SiC. Maximum and minimum ω is achieved for diamond and GaAs respectively. Maximum figure of merit is obtained for polySi with a value of 1.29*10~(14) and that of minimum is for GaAs (1.77*10~(11)).The material order in which the figure of merit Q_(TED) * ω_i changes is the same as that for quality factor change and the order in which it varies is PolySi>Diamond>Si>SiC>GaAs. The numerical analy sis is done by using MATLAB R 2015a.
机译:热弹性阻尼起着不同的能量耗散机制中的重要作用,并应在MEMS / NEMS被最小化基于谐振器用于增强其性能参数。在本文中,分析了不同的性能指标是品质因数,热弹性的频率和使用5个不同的结构材料(多晶硅,金刚石,硅,砷化镓和碳化硅)的谐振器的品质因数。品质因数是品质因数和热弹性频率应,以便为谐振器提供更好的灵敏度和噪声抑制被最大化的产品。由于装置的尺寸按比例缩小,经典连续理论不能解释在相关微米或亚微米水平,并作为非经典连续的理论是采用具有内部长度尺度参数的开始结果机械性能的大小的效果。基于基尔霍夫模型施加改性耦合应力理论各向同性矩形微板分析用于分析的大小依赖热弹性阻尼及其对品质因数的影响,并随后在所述谐振器的品质因数。据发现,所述梁由基于非经典MCST模型预测的Q_(TED)比由传统的波束模型预测大。其中Q_(TED)变化的降序顺序材料是多晶硅>的Si>金刚石>的GaAs>碳化硅。最大和最小ω为钻石和GaAs分别达到。用于多晶硅为1.29×10〜(14)的值而获得的优点的最大数字,并且最小的为砷化镓(1.77 * 10〜(11))。该材料顺序优点Q_的图(TED)* ω_i变化是相同的,对于品质因数变化和其变化是多晶硅>钻石>的Si>碳化硅>的GaAs的顺序。数值ANALY SIS通过使用MATLAB [R 2015A完成。

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