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Atomic-Level Based Non-Ionizing Energy Loss: An Application to GaAs and GaN Semiconductor Materials

机译:基于原子级的非电离能量损失:对GaAs和GaN半导体材料的应用

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Large-scale molecular dynamics (MD) simulations, along with bond-order interatomic potentials, have been employed to study defect production, clustering and their evolution within high energy displacement cascades in semiconductors. Based on the MD results, the damage density within a cascade core is evaluated, and used to describe a new energy partition function. In addition, we have further developed a model to determine the non-ionizing energy loss (NIEL) for semiconductors, which can be used to predict the displacement damage degradation induced by space radiation on electronic components. The atomic-level based NIEL model has been applied to GaAs and GaN. At low energies, the most surviving defects are single interstitials and vacancies, and only 20% of the interstitial population is contained in clusters in GaAs, but a direct-impact amorphization in GaAs occurs with a high degree of probability during the cascade lifetime for Ga PKAs (primary knock-on atoms) with energies higher than 2 keV. However, a large number of atoms will be displaced during the collisional phase with a compacted cascade volume in GaN, and consequently, a great number of displaced atoms recombine signicantly with vacancies at the same time, i.e., a pseudo-metallic behavior (PMB). This leads to the result that the majority of surviving defects are just single interstitials or vacancies for all recoil energies considered with only a small number of defects forming clusters. The total number of defects simulated in GaN can be very well predicted by the simplied Norgett, Robison and Torrens (NRT) formula due to the PMB, in contrast to GaAs where the defect number becomes much larger than the NRT value. The calculated NIEL in GaN is often found smaller than that predicted by a model based on the simple Kinchin-Pease formula. The comparisons of defect creation, density and effective NIEL in GaN to those of GaAs suggest that GaN may be much more resistant to displacement damage than GaAs, and t
机译:大规模的分子动力学(MD)模拟以及债券阶外部潜力的模拟已经用于研究半导体中的高能位移级联内的缺陷生产,聚类及其演化。基于MD结果,评估级联核心内的损伤密度,并用于描述新的能量分区功能。此外,我们进一步开发了一种模型,以确定半导体的非电离能量损失(Niel),其可用于预测电子元件上的空间辐射引起的位移损伤劣化。基于原子级的Niel模型已应用于GaAs和GaN。在低的能量下,最幸存的缺陷是单层间隙和空位,并且只有20%的间质群体包含在GaAs中的簇中,但在Ga的级联寿命期间,GaAs的直接影响非概率发生在Ga PKA(主要敲击原子)的能量高于2 keV。然而,在碰撞期间,大量原子将在GaN中具有压实的级联体积,因此,大量的位移原子同时具有空位,即伪金属行为(PMB) 。这导致了大多数存活的缺陷只是只有少量缺陷形成簇的所有反冲能量的单层间隙或空位。与PMB引起的简化Norgett,Robison和托尔森(NRT)公式预测GaN中模拟的缺陷总数,与PMB相比,与缺陷数变得大于NRT值的GaAs。 GaN中的计算镍钛通常比基于简单的Kinchin-Pease公式的模型预测的尼尔。 GAN中伤害缺陷创造,密度和有效尼尔的比较表明GaN可能比GaAs损坏,而t

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