The Influence of N2 Flow Rate on Ar and Ti Emission in High-Pressure Magnetron Sputtering System Plasma

摘要

For ionized physical vapor deposition (known as IPVD) technique, investigation on the ionization mechanism of titanium atoms is very important during the deposition of titanium nitride (TiN) thin film using reactive magnetron sputtering plasma. The introduction of nitrogen gas into the chamber discharge leads to modifications of plasma parameters and ionization mechanism of transition species. In this work, an investigation on the influence of nitrogen flow rate on spectrum properties of argon and titanium during the deposition process have been carried out. The experimental configuration consists of OES and structure of magnetron sputtering device with the turbo molecular pump. A high-pressure magnetron sputtering plasma was used as plasma discharge chamber with various flow rate of nitrogen gas. Optical emission spectroscopy (OES) measurements were employed as plasma diagnostics tool in magnetron sputtering plasma operated at relatively high pressure. OES is a non-invasive plasma diagnostics method and that can detect the atomic and ionic emission during plasma discharge. The flow rate of the Ar and N2 gas are controlled by mass flow controller. The changes of relative emission for both neutral and ionic of argon as well as titanium were observed using optical spectrometer when the nitrogen gas is introduced into the discharged chamber. We found that the titanium emission decreased very rapidly with the flow rate of nitrogen. In addition, the argon emission slightly decreased with the flow rate of nitrogen.