The determination of the thickness of the layers deposited on the electronic circuit boards through tribological methods

摘要

The purpose of the paper is to determinate the thickness of the copper layer deposit on the electronic circuit boards, the thickness of the soldering alloy SAC 307 (96.5%Sn/3.0%Ag/0.7%Cu) deposit on the copper-PCB assembly used in electronic industry and also to determinate the sliding length of the sphere on those materials. Slurry composed of water and SiC was used to reduce the testing time. For the experiment a CSEM Calowear equipment was used and the tested materials were the layer of FR4(flame retardant 4) with copper deposit and the soldering alloy SAC 307.