首页> 外文会议>PRiME Joint International Meeting of the Electrochemical Society, the Electrochemical Society of Japan, and the Korean Electrochemical Society >First principles study on the strain dependence of thermal oxidation and hydrogen annealing effect at Si/SiO_2 interface in V-MOSFET
【24h】

First principles study on the strain dependence of thermal oxidation and hydrogen annealing effect at Si/SiO_2 interface in V-MOSFET

机译:第一个原理研究V-MOSFET中Si / SiO_2接口热氧化和氢退火效应的应变依赖性

获取原文

摘要

Gate insulator of vertical MOSFET (V-MOSFET) is formed by silicon oxide. However, Si pillar cannot keep the structure during oxidation process because the Si atoms disappear from bulk (missing-Si). Moreover, the effect of hydrogen annealing for V-MOSFET under the typical condition becomes weaker than that for planer MOSFET. In this study, we revealed the physical origin of missing-Si and hydrogen annealing effects by using first principles calculation method. We considered that the strain which is accumulated at the Si/SiO_2 interface in V-MOSFET due to pillar structures. In this study, we clarified the strain dependence of thermal oxidation of V-MOSFET based on the Si-emission model [1,2]. The obtained results indicate that the compressive strain is one of the causes of the missing-Si. Furthermore, we investigated the strain dependence of the effect of hydrogen annealing. As a result, we revealed that hydrogen annealing temperature of V-MOSFET should be lower than that of planer-MOSFET.
机译:垂直MOSFET(V-MOSFET)的栅极绝缘体是由氧化硅形成。然而,硅柱不能在氧化过程保持结构,因为Si原子从大容量消失(缺少-Si)构成。此外,氢退火的用于V-MOSFET的典型条件下的效果变得比用于刨床MOSFET弱。在这项研究中,我们通过使用第一原理计算方法揭示的缺Si和氢退火效应的物理原点。我们认为,这是在V-MOSFET在Si / SiO_2界面积累由于柱状结构的应变。在这项研究中,我们阐明基于在Si-排放模型[1,2] V-MOSFET的热氧化的应变依赖性。将所得到的结果表明,压缩应变是失踪-Si的原因之一。此外,我们研究了氢退火的效果的应变依赖性。其结果是,我们发现V-MOSFET的氢退火温度应当比平面-MOSFET的低。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号