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The Influence of Lot Size on Production Performance in Wafer Fabrication Based on Simulation

机译:批量大小对基于仿真晶圆制造中生产性能的影响

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Semiconductor manufacturing has been a significant change over the past decades. Nevertheless, from production efficiency point of view, it should be argued with validity whether 25-wafer is an adaptive lot size in the future to fulfill the manufacturing processes. In this work, a simulation model to study the relationship between lot size and the performances of wafer fabrication is proposed. Three production performance indices are taken into account in this model including cycle time of products, total throughput and the waiting time of WIP by workstation. Based on the simulation result, it reveals that the cycle time of products is synchronously decreased when the lot size is shrunk. However, the waiting time of WIP is not coincident with lot downsizing. From these results, the model of this study can provide a trend to establish the best lot size to fulfill the current and future wafer fabrication.
机译:半导体制造在过去的几十年中一直存在显着变化。然而,从生产效率的角度来看,应该有效地争论25-晶片是未来适应性的批量,以满足制造过程。在这项工作中,提出了一种研究批次尺寸与晶片制造性能之间关系的仿真模型。在该模型中考虑了三种生产性能指标,包括产品的循环时间,总吞吐量和工作站的WIP等待时间。基于仿真结果,揭示当批次缩小时,产品的循环时间同步下降。然而,WIP的等待时间与众多缩小尺寸不一致。从这些结果来看,本研究的模型可以提供建立最佳批量的趋势,以满足当前和未来的晶片制造。

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