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Synthesis of Electroless Cu-Ni-Mo-P/Al_2O_3 for Glycerol Hydrogenolysis to Propan-1,2-diol

机译:用于丙醇氢解的化学型Cu-Ni-Mo-P / Al_2O_3对丙烷-1,2-二醇的甘油氢解

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A new electroless bath was formulated using a mixture of two reducing agents - NaH_2PO_2 and formaldehyde - for the synthesis of electroless Cu-Ni-Mo-P at pH of 10.2 and 80°C. High material loading was obtained at high Cu~(2+)/ Ni~(2+) molar ratio (> 1.0) in the electroless bath. In contrast, hypophosphite only baths were limited to deposit Cu-Ni-Mo-P only when the Cu~(2+)/ Ni~(2+) molar ratio in solution is below 0.17. The deposits were characterized using SEM, EDX and XRD. The deposited Cu-Ni-Mo-P catalyst was crystalline. Within Cu~(2+)/ Ni~(2+) molar ratio range of 0.08 - 1.0, the deposits contained 85-95.8% copper, 14.6 - 4% Ni, 0.26 - 0.15% Mo and 0.1-0.03% P. The results show the feasibility of the use of a mixture of reducing agents in electroless plating.
机译:使用两种还原剂 - NaH_2PO_2和甲醛的混合物配制新的化学浴 - 用于在pH为10.2和80℃的pH下合成化学镀Cu-Ni-Mo-P。在化学镀浴中,在高Cu〜(2 +)/ Ni〜(2+)摩尔比(> 1.0)下获得高材料载荷。相反,仅当溶液中的Cu〜(2 +)/ Ni〜(2+)摩尔比低于0.17时,次磷酸酯仅限于储存Cu-Ni-Mo-P。使用SEM,EDX和XRD表征沉积物。沉积的Cu-Ni-Mo-P催化剂是结晶的。在Cu〜(2 +)/ Ni〜(2+)摩尔比范围内,沉积物含有85-95.8%铜,14.6-4%Ni,0.26-0.15%Mo和0.1-0.03%P.该结果表明,在化学镀中使用还原剂的混合物的可行性。

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