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Analysis of Flatband Voltage for MOS Devices using High-K Dielectric Materials

机译:使用高k介电材料分析MOS器件的平带电压

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In this paper we have calculated Flatband voltage (V_(FB)) in terms of interface trap charges, fixed oxide charges and oxide trapped charges for thin oxide Metal Oxide Semiconductor (MOS) Devices using different high-k dielectric materials such as HfO2, ZrO2, Al2O3 and Si3N4. It has been found that the V_(FB) shift of all the samples indicated negative due to the existence of deep donor type surface states and positive interface charges, and these effects are highly responsible for variation in interface trap density with oxide thickness. It has been evaluated that, with respect to SiO2 for the same oxide thickness, high-k contributes less to V_(FB). As we move to greater dielectric constant, V_(FB) approaches to zero for the same oxide and interface charge. Excellent agreement has been observed for theoretical and simulation results.
机译:在本文中,我们在界面捕集器电荷,固定氧化物电荷和氧化物捕获的诸如使用不同高k介电材料的薄氧化物金属氧化物半导体(MOS)器件的氧化物电荷和氧化物捕获的电荷,如HFO2,ZrO2的诸如HFO2 ,Al2O3和Si3N4。 已经发现,由于深层供体类型表面状态和阳性接口电荷的存在,所有样品的V_(FB)偏移指示负面,并且这些效果非常责任涉及具有氧化物厚度的界面陷阱密度的变化。 已经评估了,对于相同氧化物厚度的SiO 2,高k少贡献到V_(FB)。 当我们移动到更大的介电常数时,V_(FB)对于相同的氧化物和界面电荷来接近零。 对于理论和模拟结果,已观察到良好的协议。

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