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Off State Breakdown Behavior of AlGaAs / InGaAs Field Plate pHEMTs

机译:Algaas / Ingaas Field Platts的状态分解行为

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Off-state breakdown voltage, Vbr, is an important parameter determining the maximum power output of microwave Field Effect Transistors (FETs). In recent years, the use of field plates has been widely adopted to significantly increase Vbr. This important technological development has extended FET technologies into new areas requiring these higher voltages and power levels. Keeping with this goal, field plates were added to an existing AlGaAs / InGaAs pseudomorphic High Electron Mobility Transistor (pHEMT) process with the aim of determining the off-state breakdown mechanism and the dependency of Vbr on the field plate design. To find the mechanism responsible for breakdown, temperature dependent off-state breakdown measurements were conducted. It was found that at low current levels, the temperature dependence indicates thermionic field emission at the Schottky gate and at higher current levels, impact ionization is indicated. The combined results imply that impact ionization is ultimately the mechanism that is responsible for the breakdown in the tested transistors, but that it is preceded by thermionic field emission from the gate. To test the dependence of V_(br) upon the field plate design, the field plate length and the etch depth through the highly-doped cap layer under the field plate were varied. Also, non-field plate devices were tested along side field plate transistors. It was found that the length of the etched region under the field plate is the dominant factor in determining the off-state breakdown of the more deeply etched devices. For less deeply etched devices, the length of the field plate is more influential. The influence of surface states between the highly doped cap layer and the passivation layer along the recess are believed to have a significant influence in the case of the more deeply etched examples. It is believed that these traps spread the electric field, thus raising the breakdown voltage. Three terminal breakdown voltages approaching 60V for the most deeply recessed devices are seen.
机译:断开状态击穿电压VBR是确定微波场效应晶体管(FET)的最大功率输出的重要参数。近年来,已经广泛采用了田间板的使用以显着增加VBR。这一重要的技术开发将FET技术扩展到需要这些较高电压和功率水平的新区域。通过该目标保持,将场板添加到现有的AlgaAs / IngaAs假形高电子迁移率晶体管(PHEMT)过程中,目的是确定越野击穿机制和VBR对现场板设计的依赖性。为了找到负责击穿的机制,进行温度依赖性的离子击穿测量。发现,在低电流水平下,温度依赖性表示肖特基栅极处的热离子场发射,并在较高的电流水平下,表示冲击电离。合并的结果意味着碰撞电离最终是负责测试晶体管中击穿的机制,而是它在栅极的热离子场发射之前。为了测试V_(BR)对现场板设计的依赖性,可以改变通过磁板下的高掺杂帽层的场板长度和蚀刻深度。此外,沿着侧场晶体管测试非场板装置。结果发现,场板下方的蚀刻区域的长度是确定更深度蚀刻装置的断开状态分解的主要因素。对于较少的深度蚀刻装置,场板的长度更具影响力。据信在高掺杂的帽层和钝化层之间的影响沿着凹槽的钝化层在更深刻的蚀刻实施例的情况下具有显着的影响。据信这些陷阱扩散了电场,从而提高了击穿电压。可以看到三个终端击穿电压为最深深的凹陷器件接近60V。

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