首页> 外文会议>ASME/ISCIE international symposium on flexible automation >TWO-DIMENSIONAL REAL-TIME INTERFEROMETRIC MONITORING SYSTEM FOR EXPOSURE CONTROLLED PROJECTION LITHOGRAPHY
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TWO-DIMENSIONAL REAL-TIME INTERFEROMETRIC MONITORING SYSTEM FOR EXPOSURE CONTROLLED PROJECTION LITHOGRAPHY

机译:用于曝光控制投影光刻的二维实时干涉监测系统

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Stereolithography is an additive manufacturing process in which liquid photopolymer resin is cross-linked and converted to solid polymer with an ultraviolet light source. Exposure Controlled Projection Lithography (ECPL) is a stereolithographic process in which incident radiation, patterned by a dynamic mask, passes through a transparent substrate to cure a photopolymer layer that grows progressively from the substrate surface. In contrast to existing stereolithography techniques, this technique uses a gray-scale projected image, or alternatively a series of binary bit-map images, to produce a three-dimensional polymer object with the desired shape, and it can be used on either flat or curved substrates. Like most stereolithographic technologies, ECPL works in a unidirectional fashion. Calibration constants derived experimentally are fed to the software used to control the system. This unidirectional fabrication method does not, by itself, allow the system to compensate for minor variations, thereby limiting the overall accuracy of the process. We present here a simple, real-time monitoring system based on interferometry, which can be used to provide feedback control to the ECPL process, thus making it more robust and increasing system accuracy. The results obtained from this monitoring system provide a means to better visualize and understand the various phenomena occurring during the photopolymerization of transparent photopolymers.
机译:立体镀缩影是一种添加剂制造方法,其中液体光聚合物树脂与紫外光源交联并转化为固体聚合物。曝光控制的投影光刻(ECPL)是由动态掩模图案化的入射辐射通过透明基板来固化从基板表面逐渐生长的光聚合物层。与现有的立体光刻技术相比,该技术使用灰度投影图像,或者是一系列二进制比特图图像,以产生具有所需形状的三维聚合物对象,并且可以在平坦的或弯曲的基板。与大多数立体化技术一样,ECPL以单向方式工作。通过实验衍生的校准常数被馈送到用于控制系统的软件。这种单向制造方法本身不允许系统补偿次要变化,从而限制了过程的整体精度。我们在这里存在基于干涉测量的简单实时监控系统,可用于向ECPL工艺提供反馈控制,从而使系统精度更加坚固和提高。从该监测系统获得的结果提供了一种更好地可视化和理解在透明光聚合物光聚合期间发生的各种现象的方法。

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