Opto-Electronic Hybrid Integrated Platform for High-Speed Telecom/Datacom Applications: Microwave Design and Optimization

摘要

An opto-electronic hybrid integrated platform was developed to enable the fabrication of broadband, low-cost, and compact transceivers for telecommunications. On this platform, an opto-electronic device such as a high-speed laser or a photodetector chip is integrated with a RF driver or an amplifier IC. A Kovar heatsink with multistep structure is designed for ease of optical coupling using a laser welding process. In order to control the high frequency resonances and improve the signal integrity, A1N based subcircuits are designed to feed the RF and DC signals separately. The interconnection networks between the IC and the opto-electronic device and also between the chips and high-speed transmission lines are carefully investigated to optimize the microwave performances. The influence of the packaging for this opto-electronic integration platform on the microwave performance is also analyzed in detail. The simulation results obtained and successful fabrication of a transmitter module demonstrate that the proposed platform can meet the requirements for high-speed WDM or TDM systems.