首页> 外文会议>Conference on optical microlithography XXVI >Introducing a Novel Flow to Estimate Challenges Encountered While Transitioning from RET Development to Manufacturable Solution
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Introducing a Novel Flow to Estimate Challenges Encountered While Transitioning from RET Development to Manufacturable Solution

机译:引入新颖的流程来估算从RET开发转换到生产解决方案时遇到的挑战

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Source Mask Optimization (SMO) has become an integral part of resolution enhancement techniques (RET) for almost all critical layers at advanced technology nodes. Over the past couple of years, various flows have emerged for integrating SMO into mainstream RET selection. These flows revolve mainly around clip selection, resist model, verification and analysis metrics, design rule optimization, and so on. There has also been strong emphasis on the quality of mask that is conjugated for source selection process. All these variations in analysis and rigorous simulations for flow selection are critical but they also create a bottleneck in overall RET development. In this paper, we demonstrate an initial RET development flow for 20 nm technology with emphasis on quantifying benefits coming from source and mask. We also report challenges that are encountered in the foundry environment when moving from RET development to production. In conclusion, we demonstrate a reliable solution that could be integrated early in RET development and easily adapted for a production environment.
机译:源掩模优化(SMO)已成为高级技术节点上几乎所有关键层的分辨率增强技术(RET)的组成部分。在过去的几年里,已经出现了各种流动,将SMO整合到主流RET选择中。这些流程主要围绕剪辑选择,抵抗模型,验证和分析指标,设计规则优化等。对源选择过程共轭的掩模质量也强烈强调。流动选择的分析和严格模拟的所有这些变化都是至关重要的,但它们也在整体RET开发中创造了一个瓶颈。在本文中,我们展示了20 nm技术的初始RET开发流程,重点是量化来自源头和面具的益处。我们还报告了从RET开发到生产中遇到铸造环境中遇到的挑战。总之,我们展示了一种可靠的解决方案,可以在RET开发中综合整合,并容易适应生产环境。

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