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The Effects of Wet Surface Treatments on Amorphous Silicon Annealing and Gate Breakdown Voltage

机译:湿表面处理对非晶硅退火和闸门击穿电压的影响

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The formation of CMOS transistors requires the integration of several steps including deposition, annealing, cleaning, and patterning. This paper investigates the nature of the interface between amorphous silicon (a-Si) and silicon nitride (Si_3N_4), and its impact on the gate breakdown voltage. It has been found that a continuous native oxide between a-Si and Si_3N_4 is critical in preventing the agglomeration of silicon during high temperature annealing.
机译:CMOS晶体管的形成需要几个步骤的整合,包括沉积,退火,清洁和图案化。本文研究了无定形硅(A-Si)和氮化硅(Si_3N_4)之间的界面的性质及其对栅极击穿电压的影响。已经发现,A-Si和Si_3N_4之间的连续天然氧化物对于在高温退火期间防止硅的附聚是至关重要的。

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