Micro Packaging of Hermetic Seal Laser Diode Module for the Harsh Environment of Aerospace Applications

摘要

This paper describes micro soldering method of hermetic DIL (dual in line) laser diode module packaging. Normally, reliable, reproducible, high-yield packaging technologies are essential for meeting the cost, performance, and service objectives for the harsh environment of aerospace applications. For this package a new novel technique incorporating microscope with twin micro tweezers, a CCD image captured camera as monitoring probe and preformed rings of Pb-Sn and In-Sn alloys for hermetic sealing using a micro-soldering process was developed. The procedure is able to confine the solder seal to a small region inside the ferrule near the fiber feed-through hole on the wall of the DIL package. After completing the development, which included temperature and thermal cycling and analysis showed the improved method using lead-tin alloy had no fiber damage after the micro-soldering seal. The new process resulted in 100% success in our packaging design.