BREAKING THROUGH FLUX RESIDUES TO PROVIDE RELIABLE PROBING ON PCBAS-CONSISTENT CONNECTIONS ACROSS DIFFERENT NO-CLEAN SOLDERS, FLUXES AND LAND DESIGNS

摘要

No-clean fluxes have been in use for many years, but there is a need for knowledge that allows the industry to better understand the robustness of probing methodologies across different wave and reflow processes. Can different fluxes be used reliably? What pressures and probes are required? This paper discusses the variety of challenges presented by probing solder pads, including the use of different types of solder, fluxes and land designs. In this study, concerns involving the reliability of probing different solder/flux compounds, the land configurations, the contact pressures and probe styles will be discussed in detail.