LOW COST BGA REWORK FEASIBILITY STUDY

摘要

Currently surface mount technology (SMT) rework for ball grid array (BGA) packages is performed mainly using expensive automated rework machines. There has been growing interest from some ODMs, especially in low end markets, who do not wish to invest in the high cost tools and want to develop alternative low cost rework tools and methodologies. A study was performed to determine the feasibility of using a heat gun rework station, in this case a JBC heat gun, as an alternative way to perform the necessary rework at a lower cost. This paper discusses the heat gun rework study purpose, setup and results using 2 different flip-chip BGA packages. Package A is a 17×17mm and package B is a 16.5×20mm. Evaluations include the removal and replacement of the BGA packages on the motherboard using the JBC heat gun together with other equipment, and performing X-ray and dye-and-pull analysis to determine the yield success. The initial results indicate the potential for using a heat gun as an alternative method to perform rework on BGA components. Work is ongoing to improve the process and understand the limitations on package size that can be reworked with low cost tools and impact of variables such as board size and thickness.