Component Package Decapsulation Process with Analogue Signature Analysis Support

摘要

Paper deals with the problem of considerate electronic component package opening for failure analysis purposes. That opening makes the system on chip accessible for detailed optical inspection as well as for electrical tests accompanied with surface events observation. The notion for such kind of package selective opening is called decapsulation, and the paper mentions the main techniques of that. The laser decapsulation technique is described in relation to experiments aimed at the proper process programming supported with analogue signature analysis. Illustrating pictures accompany the experiments of process development.