Stamp tooling application for high power LED packaging fabrication

摘要

The high power light emitting diodes unit internal structure was elaborated from materials and tooling point of view, the unit matrix layout in copper frame for mass production was presented for fully automatic stamping. The processes and tooling stations were decomposed and optimized according to the formulated stamping sequences, facilitating the downstream packaging processes. The final leads bending and unit singulation mechanisms were proposed. The universal tooling design scheme for multiple material composed opti-electric units can be referenced for similar integrated functional devices.