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A Novel Method for Delay Analysis of CMOS Inverter with On-Chip RLC Interconnect Load

机译:用片上RLC互连负载延迟分析CMOS逆变器的新方法

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In this paper, the behaviour of CMOS inverter driving RLC interconnect load is analyzed. The analysis is based on the modelling of RLC load, developed for submicron devices. Sakurai's alpha-power law is used here for representing the transistor current. Accurate and analytical expressions for the output voltage waveform are derived by solving the system of differential equations which describe the behaviour of the circuit. The 50% delay for on-chip interconnect is then calculated from the transient response. The output response derived from this model is compared with the SPICE simulation results and the results obtained by using the proposed model are in good agreement with SPICE model. The maximum error has been found to be 9.4%.
机译:在本文中,分析了CMOS逆变器驱动RLC互连负荷的行为。分析基于为亚微米器件开发的RLC负载的建模。这里使用Sakurai的alpha-power法律来代表晶体管电流。通过求解描述电路行为的微分方程系统来导出用于输出电压波形的准确和分析表达式。然后从瞬态响应计算片上互连的50%延迟。将从该模型的输出响应与Spice仿真结果进行比较,并且通过使用所提出的模型获得的结果与Spice Model吻合良好。已发现最大错误为9.4%。

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