aluminium alloys; elongation; solders; tensile strength; tin alloys; zinc alloys; Zn-Al-Sn; electronic parameter; elongation; high temperature lead-free solder; mechanical property prediction; power semiconductor devices packages; pressure 195 MPa to 225 MPa; s-orbital energy level; system multicomponent alloys; temperature 645 K to 973 K; ultimate tensile strength; zinc system alloys; Lead; Solids; Temperature; Temperature measurement; Tin; Zinc;
机译:镁的添加对无铅锌银焊料合金组织和力学性能的影响
机译:稀土CE对ZN-30SN-2CU高温无铅焊料合金热行为,微观结构和力学性能的影响
机译:Sn-3.0ag-0.5cu无铅焊料合金的力学性能与各相的温度关系
机译:锌系合金力学性能的预测及其在高温无铅焊料中的应用
机译:电子应用焊料的机械性能和疲劳寿命预测:锡银和锡锌共晶
机译:无铅焊料合金:(Au + Sb + Sn)和(Au + Sb)系统的热力学性质
机译:将痕量Ni和Ge加入SN-Sb-Ag高温无铅焊料合金的影响其机械性能