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Mechanical properties and fatigue lifetime prediction of solders for electronic applications: Tin-silver and tin-zinc eutectics

机译：电子应用焊料的机械性能和疲劳寿命预测：锡银和锡锌共晶

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作者
Mavoori, Hareesh;
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作者单位

Northwestern University;

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授予单位 Northwestern University;
学科
学位 Ph.D.
年度 1996
页码 172 p.
总页数 172
原文格式 PDF
正文语种 eng
中图分类
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专利

1. Effects of Palladium and Solder Aging on Mechanical and Fatigue Properties of Tin-Lead Eutectic Solder [J] . S. VAYNMAN, G. GHOSH, M.E. FINE Journal of Electronic Materials . 1998,第7a12期

机译：钯和焊锡时效对锡铅共晶焊锡力学和疲劳性能的影响
2. Effects of Palladium and Solder Aging on Mechanical and Fatigue Properties of Tin-Lead Eutectic Solder [J] . S. VAYNMAN, G. GHOSH, M.E. FINE Journal of Electronic Materials . 1998,第11期

机译：钯和焊料时效对锡铅共晶焊料力学和疲劳性能的影响
3. Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling [J] . Z. Sun, L Benabou, P.R. Dahoo Engineering Fracture Mechanics . 2013,第Null期

机译：被动温度循环下电力电子模块中焊点的热机械疲劳预测
4. Prediction of Statistical Distribution of Vibration-Induced Solder Fatigue Failure Considering Intrinsic Variations of Mechanical Properties of Anisotropic Sn-Rich Solder Alloys [C] . Hsiu-Ping Wei, Yu-Hsiang Yang, Bulong Wu, IEEE Electronic Components and Technology Conference . 2018

机译：考虑各向异性Sn-Rich焊料合金力学性能的内在变化的振动引起的焊料疲劳破坏的统计分布预测
5. Characterization of microstructural evolution of crept, aged and thermomechanically fatigued eutectic tin-silver solder joints using orientation imaging microscopy. [D] . Telang, Adwait Uday. 2002

机译：使用定向成像显微镜表征蠕变，老化和热机械疲劳的共晶锡银焊点的微观结构演变。
6. Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys [O] . Wenchao Yang, Jidong Li, Yitai Li, 2019

机译：铝添加对非共晶Sn-20Bi焊料合金的组织和性能的影响
7. Microstructurally Based Thermomechanical Fatigue Lifetime Model of Solder Joints for Electronic Applications [O] . D. R. Frear, M. M. Rashid, S. N. Burchett 1993

机译：用于电子应用的焊点的微结构基于热机械疲劳模型
8. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications [R] . Frear, D. R., Rashid, M. M., Burchett, S. N. 1993

机译：基于微观结构的电子应用焊点热机械疲劳寿命模型

Mechanical properties and fatigue lifetime prediction of solders for electronic applications: Tin-silver and tin-zinc eutectics

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