This paper reports a study on the dynamics of foil-based functional component self-alignment onto patterned test substrates and its demonstration when integrating a flexible sensor onto a printed circuitry. We investigate the dependence of alignment time and final precision of stacking of mm-and cm-sized foil dies on a number of system parameters, such as amount of assembly medium dispensed on target positions, size and weight of assembling dies and their initial misalignment. Using water as a medium for direct self-alignment, mm-and cm-sized square-shaped pre-marked foil dies were aligned with accuracy down to 30 μm and smaller, which reflects a high precision relatively to their lateral dimensions on patterned marked carriers. High-speed camera stage and image recognition tools were used for analyzing rapid capillary-driven self-alignment processes of marked foil dies. It is shown that there is a definite range of initial misalignment values allowing dies to align with high accuracy and yield within the same time window, whereas both under smaller and larger initial offsets, i.e. with dies correspondingly too close or too far from their target positions, yield and alignment precision is significantly lower. The high-alignment accuracy of mm-to cm-sized functional foils was demonstrated by means of the integration of an interdigitated electrodes (IDE) capacitive sensor to a flexible polymeric substrate. Additionally, high-yield electrical interconnection was performed using anisotropic conductive adhesives (ACA). The latter opens the perspective of efficiently assembling interesting new systems such as separately manufactured sensors, paper batteries and RFIDs components through the direct capillary-driven self-alignment approach and ACA electrical interconnection.
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