Possibilities of Corrosion Simulation in Microelectronic Packages and Assemblies

摘要

Corrosion of electronic components appear in several ways. Microelectronic components are now an essential part of the technology-intensive industry products beginning from aerospace, automotive, over medical equipment and consumer products. This means the products are exposed to a variety of environmental conditions. More than 20% of failures in microelectronic devices can be attributed to corrosion. Due to the small dimensions in the range of micro- and nanometers they are orders ofmagnitudes more sensitive against corrosion. Most metal corrosion occurs via electrochemical reactions at the interface between the metal and an electrolyte solution. In an environment where proportions of water surround the metal atoms at the surface of the metal enter the solution as metal ions. Overall corrosion is a very complex multiphysics problem. The formulas and equations used in corrosion calculation base on the theory of electrochemistry. In general corrosion is a diffusion process which leads to concentration gradients and a mass transport across a metal interface as driving force of voids and hillocks in and on the observed structure. Simulation programs permitting corrosion prediction are not sufficiently available yet. Approach for calculating the corrosion is similar to IMC-growth in solder joints and migration process in interconnects. A possibility to fit in corrosion models into finite element simulations, to parameterize Finite Element Simulations will be proposed.