MEMS Sensor packaging: Technology evolution to enable standardization, HVM flexible platforms

摘要

Packaging accounts for 20-60% of the MEMS/Sensor device BOM and is a key part of the MEMS function and design. Packaging creates additional value as the MEMS/Sensor device is integrated into a system (SiP, module). Contradictory market requirements: differentiation and standardization. Standardization enables high volume production (second sourcing, cost efficiency through technology sharing). Cost effective integration can be achieved with MEMS/Sensor Wafer Level Packaging. Each WLP is unique. Standardization is in the toolbox - combination of "standard" building blocks. ASE hopes to set the standard with differentiating solutions: WLP and 3D integration.