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Influence of annealing temperature on microstructure and magnetic properties of Ti/Ni/Ti thin films

机译:退火温度对Ti / Ni / Ti薄膜微观结构和磁性性能的影响

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Ti(3nm)/Ni(10nm)/Ti(3nm) films were deposited directly on glass substrates using dc facing-target magnetron sputtering system at room temperature and in situ-annealed from room temperature(RT) to annealing temperature(Ta) 500°C, respectively. At Ta = 400°C, the gain size was about 15 nm, and the magnetic domains of the films distributed homogenously, and the magnetic domain cluster size was nearly 25 nm. The maximum perpendicular coercivity of Ti(3nm)/Ni(10nm)/Ti(3nm) films was 1360 Oe. The segregation or diffusion of Ti and the stress anisotropy played important roles to increase the coercivity. The intergrain interaction of films was obtained by δM plots. In annealing films, X-ray diffraction (XRD) profiles showed two diffraction peaks of NiTimonoclinic structure (002), (111) lattice orientations.
机译:在室温下使用DC面向靶磁控溅射系统直接在玻璃基板上直接沉积Ti(3nm)/ Ni(10nm)/ Ti(3nm)膜,从室温(RT)原位 - 退火温度(TA)500 °C分别。在Ta = 400℃下,增益尺寸为约15nm,并且均匀分布的薄膜的磁性结构域,磁畴簇尺寸差约为25nm。 Ti(3nm)/ Ni(10nm)/ Ti(3nm)膜的最大垂直矫顽力是1360°OE。 Ti的分离或扩散和应力各向异性起到了增加矫顽力的重要作用。通过ΔM图获得膜的晶体相互作用。在退火薄膜中,X射线衍射(XRD)曲线显示尼昔替尼结构(002)的两个衍射峰,(111)晶格取向。

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